MultiFlow Adhesive Filler AF-M Series
Zero Cross-Contamination. Infinite Formulations.
Core Innovation: Isolated Path Technology™
Shanghai Guangzhi AF-M Series revolutionizes multi-adhesive filling with dedicated flow paths per formulation, achieving ±0.4% accuracy at 40 cans/hour for epoxies, silicones, PU (50-500,000 cP). Featuring tool-free pipe swaps <15s, self-purging nozzles, and ATEX Zone 2 certification, it eliminates residue carryover while serving medical device assembly, electronics, and automotive bonding applications.
Technology Highlights
1. Patented PipeQuick™ System
Key Specifications:
Component | Technology | Performance |
---|
Quick-Change Pipes | Magnetic V-lock couplings | <0.1ml residual |
Nozzle Interface | Self-centering taper seal | 10,000 cycles leak-proof |
Cleaning Protocol | 3-stage solvent/air/N₂ purge | <5ml waste per change |
2. Adhesive-Specific Engineering
Adhesive Type | Pipe Material | Special Features |
---|
Medical Epoxy | 316L EP + PEEK | USP Class VI compliance |
Electronics Silicone | Fluorinated ethylene propylene | Static dissipative (<10⁶ Ω) |
Automotive PU | Hastelloy C276 + Kalrez® | Heated jacket (60°C) |
Conductive Adhesive | Diamond-like carbon coating | Resistivity control ±5% |
Technical Specifications
Model | AF-M200 (Standard) | AF-M300X (ATEX) | AF-M400M (Medical) |
---|
Capacity | 1-20kg (±0.4%) | 1-15kg (±0.5%) | 0.5-10kg (±0.3%) |
Throughput | 40 cans/hour | 35 cans/hour | 30 cans/hour |
Viscosity Range | 50-500,000 cP | 100-300,000 cP | 50-200,000 cP |
Pipe Change Time | <15s | <20s | <12s |
Pipe Options | 6-24 paths | 6-18 paths | 8-16 paths |
Material Contact | 316L SS + FEP | 316L + ATEX polymers | 316L EP + USP VI PEEK |
Power | 380V/50Hz, 5.5kW | 24VDC Ex ia | 380V/50Hz, 4.8kW |
Air Consumption | 120 L/min @ 0.6MPa | 100 L/min @ 0.6MPa | 90 L/min @ 0.6MPa |
Cleanability | CIP/SIP ready | Solvent purge | Steam sterilization |
Footprint (L×W×H) | 2500×1600×2200mm | 2700×1700×2400mm | 2400×1500×2100mm |
Industry-Specific Solutions
Medical Device Assembly
Electronics Manufacturing
Feature | IPC-A-610 Compliance |
---|
Conductive adhesive | Resistivity control ±5% |
Underfill epoxy | Void prevention <0.1% |
Silicone encapsulation | Low ionic content (<10ppm Cl⁻) |
Automotive Bonding
IATF 16949 data integrity
Viscosity-temperature modeling
Crash-resistant formula database
Aerospace Adhesives
MIL-STD-882 safety protocols
Outgassing control <1% (ASTM E595)
Cryogenic performance mode (-55°C)
Smart Control Ecosystem
10" HMI with Adhesive Intelligence
图片代码flowchart LR
A[Formula Library] --> B[Pipe Allocation]B --> C[Auto-Purge Sequence]C --> D[Usage Analytics]Formula LibraryPipe AllocationAuto-Purge SequenceUsage Analytics
Key Modules:
Operational Impact
Electronics Contract Manufacturer:
Challenge: 3% failure rate from silicone/epoxy contamination
AF-M200 Solution:
▶ Dedicated pipes + auto-purge
Results:
▶ Zero cross-contamination in 12M fills
▶ $950k/year savings in rework
▶ ROI: 6 months
Certifications & Upgrades
Global Compliance:
Advanced Modules:
Module | Function |
---|
Inline Viscometer | Real-time viscosity (±50 cP) |
Moisture Analyzer | H₂O ppm detection (0-1000ppm) |
AR Pipe Mapping | HoloLens-guided path verification |
Blockchain Trace | Immutable material genealogy |
Service Commitment
24/7 Adhesive Guardians:
Precision Isolated. Perfection Multiplied.
Shanghai Guangzhi AF-M Series: Where every adhesive flows through its own pristine path – from medical-grade epoxies to aerospace sealants.